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Semiconductor Industrial Breaking News

TSMC made a major adjustment: The old 8-inch wafer factory switched to producing EUV…

The advanced packaging market size will exceed US$79.4 billion in 2030, with at least…

Oracle and OpenAI sign a $300 billion computing power agreement. Demand for AI chips…

NVIDIA has released a new GPU, Rubin CPX, designed for long-context AI reasoning. Apple…

Intel CFO David Zinsner: 30% of Intel chips are manufactured by TSMC, future foundry may…

Intel CFO: 14A will be more expensive than 18A due to the use of…

TSMC new advanced packaging facility will remain in Chiayi and will begin production in…

Intel has appointed a new head of its data center and PC chip division,…

Intel CFO revealed the latest financing progress: US government is expected to allocate another…