Chips produced at TSMC US factories still need to be flown back to Taiwan for packaging.
It is reported that Samsung has completed the basic design of the second-generation 2nm GAA process.
Micron pushes the boundaries of PC performance with Adaptive Write Technology and G9 QLC NAND.
Mainland China is expected to surpass Taiwan in 2030 and become the world’s largest semiconductor wafer foundry center. Yole Group
UMC is evaluating entering the 6nm process and may deepen its cooperation with Intel.
Wolfspeed officially files for bankruptcy.
Japan Towa Corporation plans to build a third packaging equipment factory in South Korea to meet the demand for AI chips.
Yamaha Robotics was founded to develop chip manufacturing equipment.
Samsung DS division head Young Hyun Jun visited Nvidia headquarters to discuss the supply of 12-layer high-bandwidth memory (HBM3E) for the GB300 Blackwell Ultra.
