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Semiconductor Industry Breaking News

TSMC’s 2nm monthly capacity will increase from 90,000 wafers at 2026-end to 110,000 by mid-2027, while 3nm capacity rises from over 180,000 to 210,000. Samsung resumed foundry talks with Qualcomm to negotiate product specifications, pricing, and process optimization as 2nm…

Semiconductor Industry Breaking News

TSMC accelerates the construction of its 1.4nm plant, with mass production expected to begin in H2 2027. OpenAI collaborates with Samsung to develop next-generation chips. It’s reported that wafer foundry negotiations between Qualcomm and Samsung have stalled due to disagreements…