Samsung accelerates the R&D of silicon photonics technology and plans to complete wafer testing by the end of 2026. Qualcomm: Amazon may purchase AI data center chips and related products worth up to $60 billion in the future. NVIDIA’s Rubin…
TSMC plans to adopt ASML’s high numerical aperture technology in advanced process mass production starting in 2030. Apple and Kioxia sign long-term NAND supply agreement, possibly with no price cap. Samsung plans to apply high numerical aperture EUV to the…
Samsung’s 4nm process is operating at full capacity, with more than half of its capacity allocated to HBM4. Changxin Memory Technologies has established in-depth cooperation with Alibaba Cloud and ByteDance. The price of INTEL PC CPUs is reportedly to rise…
TSMC ramps up its capacity for advanced processes below 3nm. Jensen Huang: OpenAI GPT-6 Astra has completed training using 100,000 NVLink 72 chips. Artificial General Intelligence (AGI) has officially arrived. DeepSeek is reportedly to purchase 160,000 Huawei Ascend 950DT chips.…
Micron plans to significantly expand its HBM production capacity this year, potentially doubling its output. ETNews It’s reported that SK Hynix is considering simultaneously advancing its investments in Yongin and Gwangju. Samsung and Arm are reportedly jointly developing next-generation edge…
It’s reported that a shortage of TSMC’s CoWoS has led customers to turn to INTEL’s EMIB-T. SK Hynix’s silicon wafer procurement volume increased by 104% quarter-on-quarter in Q2 2026. It’s reported that Micron is exploring the development of NAND flash…
It’s reported that Samsung’s memory business will allocate approximately 70% of its capacity to long-term contracts extending to 2031. TSMC: Demand for AI computing power grows fivefold annually; TSMC will leverage advanced logic processes, 3D Fabric, SoIC, CoWoS, and silicon…
TSMC executives: Silicon photonics penetration rate will exceed 50% by 2027; CPO will enter mass production in H2 2026. South Korea announced three major projects: semiconductors, AI data centers, and physical AI, with a total corporate investment of USD 1.096…
INTEL 14A’s defect density on 22nm ‘tracking better than expected’, says CFO David Zinsner NVIDIA wins contract from Amazon to purchase 2 million AI chips. SK Hynix is considering outsourcing some of its HBM base die manufacturing to INTEL. TSMC…
TSMC’s market share in the pure-play foundry services reached 73% in Q2 2026. Counterpoint Research The production capacity of NVIDIA Vera Rubin is faster than expected, amid the continued growth in demand for AI infrastructure. Omdia predicts that shipments of…
