TSMC made a major adjustment: The old 8-inch wafer factory switched to producing EUV mask protective film.
HBF (High Bandwidth Flash) will soon rise and develop in parallel with HBM. Thelec
China AI chip production capacity is growing, but advanced process equipment and HBM remain bottlenecks.
Texas Instruments CEO Haviv Ilan: The data center market is expected to grow strongly.
Bain Capital sold its Chinese data center business to Guangdong Hec Technology Holding CO.,LTD. for $3.93 billion.
It is reported that BOE will supply more than 4 million LCD panels to Samsung in 2026.
MCX W23 wireless MCU is released, enabling low-power, lightweight, and more intelligent edge wireless sensing applications.
It is reported that BYD is accelerating its layout in the Indian market and plans to launch models in 2026.
Oracle expects its revenue to grow eightfold over the next 4 years.
