Samsung and SK Hynix plan to complete the development of HBM4E in H1 2026.
IBM unveils Loon, a new experimental quantum computing chip.
Micron will launch a large-scale recruitment drive in South Korea to compete for HBM talent.
Vietnam high-tech subsidy reforms raise concerns; South Korean companies such as Samsung face rising costs.
Samsung Galaxy Z TriFold will be priced at over $2,049.59 and will be available in South Korea in early December 2025.
Qualcomm releases its first industrial-grade PC processor, the Dragonwing IQ-X series.
Vishay launches VEMD8083 high-speed silicon PIN photodiode for wearable and biomedical sensors.
Apple has chosen HMO as its next-generation display technology to accelerate the development of low-power, high-resolution screens.
WPG Holdings restructures to form dual-core distribution engines under AIT and WPI.
