ARM to set up chip IP R&D center in Hong Kong focused on AI.
Rapidus releases radiation generator and predictor.
Nebius releases next-generation AI cloud platform based on NVIDIA Blackwell Ultra chip.
Micron CEO Sanjay Mehrotra: Global HBM market is expected to reach $100 billion by 2028.
US International Trade Commission has formally launched a Section 337 investigation into semiconductor devices and their downstream computing products and components, with companies such as AMD and Lenovo listed as defendants.
ROHM rolls out low-power DC motor driver ICs for appliance and industrial uses.
Bosch wins a multi-billion dollar global ADAS contract from Toyota; mass production will begin in 2028.
Global automotive semiconductor market is projected to reach nearly $100 billion by 2029.
South Korean Minister of Science and Technology: China AI capabilities may surpass US; South Korea plans to expand infrastructure construction to seize the initiative.
