TSMC has simultaneously started 2nm process production in Hsinchu and Kaohsiung.
Samsung plans to achieve a monthly production capacity of 250,000 HBM wafers by the end of 2026, a 47% increase from its current monthly capacity of 170,000 wafers. ETNews
NVIDIA is reportedly in talks to acquire Israeli company AI21 Labs for up to $3 billion. Calcalist
Arm releases 20 technology predictions for AI chip architecture innovation in 2026
HBM is leading an AI-driven memory revolution and has become a major driver of DRAM market growth.
US International Trade Commission (ITC) has officially launched a Section 337 investigation into DRAM devices and their downstream products and components, with companies such as Samsung and Google among those being investigated.
The transparent display market is projected to reach $100 million in revenue by 2032. Omdia
Wingtech takes legal action to protect Nexperia shareholder rights, claims could reach $8 billion.
TSMC factory in Arizona is expected to begin mass production of 3nm process chips in 2027.
