It’s reported that TSMC will launch a major capacity expansion plan in 2026.
Samsung plans to increase its monthly HBM production capacity by 50% by the end of 2026, with the goal of securing HBM4 orders from NVIDIA.
Google, Meta, Microsoft, and Amazon AWS, the four major cloud service providers (CSPs) in North America, continue to expand their investment in AI infrastructure, with total investment aiming for $600 billion.
India has approved a $4.6 billion electronic component manufacturing project, a major push to localize its manufacturing sector.
ROHM announces price increase for semiconductor products.
Fujitsu partners with SoftBank; Japanese semiconductor companies join forces to develop HBM alternative.
MediaTek launched the Filogic 8000 series at CES 2026, leading the development of the Wi-Fi 8 ecosystem.
Jensen Huang and Yuanqing Yang in conversation; NVIDIA partnership with Lenovo is expected to grow fivefold.
Due to a shortage of GPUs, German distributors have stopped selling high-end graphics cards such as the RTX 5090.
