Jensen Huang: NVIDIA AI platform Rubin is now in full production.
NVIDIA: Demand for H200 chips in the Chinese market is strong, and supply is ample.
INTEL unveiled its next-generation PC chip, manufactured using the 18A process, at CES 2026.
The commissioning date for the SK Hynix DRAM cluster cleanroom has been moved up to March 2027.
Samsung Display showcased its technological prowess at the 2026 Consumer Electronics Show (CES), introducing AI-powered OLED robots, low-temperature resistant automotive displays.
US media tests indicate that ChatGPT built-in app has a poor user experience, making it unlikely to challenge Apple dominance in the App Store.
Samsung Display showcased a crease-free, foldable OLED panel at CES 2026.
In Q1 2026, conventional DRAM contract prices are expected to rise by 55-60% month-on-month; NAND flash memory contract prices are expected to continue to rise by 33-38%. TrendForce
Rising labor costs and a significant increase in wafer depreciation expenses led to a nearly 87% drop in gross margin at TSMC US factories.
