TSMC AP7 (Advanced Packaging) to debut in Chiayi on January 22nd, 2026 and TSMC’s CoPoS is scheduled to enter mass production by the end of 2028.
G42: Advanced AI chips from NVIDIA, AMD will arrive in the UAE within a few months.
TSMC to increase investment in advanced packaging: WMCM capacity may double by 2027, targeting the new chip for iPhone 18.
Google DeepMind CEO Demis Hassabis: China is about six months behind the West in AI innovation.
Musk: Initial production of Tesla Cybercab and Optimus is “extremely slow”.
JX Advanced Metals, Japanese chip materials supplier, is considering investing $31.66 million in Rapidus and may supply the company with materials.
American Chamber of Commerce in China: 71% of American companies are not considering leaving China.
Proportion of ASIC AI servers will increase to 27.8% by 2026. TrendForce
G42: Increase total data center capacity to 5 gigawatts in the next few years.
