TSMC’s US-based chip manufacturing plant will still ship 100% of its chips back to Taiwan; advanced packaging becomes the next bottleneck for AI.
SK Hynix is actively targeting 1c DRAM: Yield rate has risen to 80%, and more than half of its capacity will be converted in 2026.
Shipments of NVIDIA’s Rubin chip have been delayed, and Blackwell will account for more than 70% of high-end GPU shipments. TrendForce
INTEL has successfully produced the world’s thinnest gallium nitride chip, which is only 19μm thick.
It’s reported that Samsung and Apple have reached an agreement for Samsung to exclusively supply OLED panels for foldable iPhones for the next three years.
Meta released a new AI model, Muse Spark.
Anthropic’s appeal was thwarted; a US court refused to block the Department of Defense from adding Anthropic to the blacklist.
The US Federal Communications Commission is considering a complete ban on Chinese laboratories testing US electronic products.
Hanmi Semiconductor will unveil its second-generation hybrid bonding machine prototype.
