TSMC’s CoPoS production line is expected to be fully completed in June 2026.
Samsung Electro-Mechanics will provide FC-BGA packaging substrates for NVIDIA’s Groq3 AI chip.
Apple has significantly increased its SoIC capacity bookings with TSMC, targeting Baltra AI server chips. Morgan Stanley
Advanced packaging technology has become a new bottleneck for AI chips, and the US urgently needs to fill this gap in its domestic capabilities. US media
Rapidus recently announced the official launch of its pilot semiconductor packaging production line and plans to develop a new technology that could increase the production efficiency of AI chips by more than 10 times. Nikkei
OpenAI criticized Anthropic for its limited development capabilities, claiming it benefits from the “compound interest advantage.”
TrendForce predicts that the production of humanoid robots in Chineses Mainland will increase by 94% in 2026, with Unitree and Agibot accounting for nearly 80% of the market share.
Given the increasing limitations of large-scale models, Alibaba led a $290 million investment in Shengshu Technology to develop new large-scale models.
SanDisk has begun building its HBF supply chain; the production line is expected to be completed in H2 2026. ETNews
Japan has provided Rapidus with an additional $4 billion in subsidies to enable the mass production of 2nm chips.
