C.C. Wei discusses the competition between Terafab and INTEL: No shortcuts to expanding production capacity.
The industrialization of glass substrates is accelerating: TSMC is building a pilot project for a CoPoS packaging production line.
Musk has demanded that the Terafab project move forward at full speed and has already inquired with suppliers about equipment quotes and delivery times.
Yageo: AI orders are expected to continue into H2 2026, benefiting from increased penetration in servers and data centers.
TSMC’s revenue reached $35.92 billion in Q1 2026, a year-on-year increase of 35.1%.
TSMC: Market demand for AI is very strong; capital expenditure over the next three years will be much higher than in the past three years.
TSMC: We have safe reserves of helium and hydrogen, and the supply of raw materials will not be affected in the short term.
TSMC: 2nm process has entered mass production stage; increasing capital investment to boost 3nm capacity.
TSMC: CPUs are becoming increasingly important in AI data centers.
