TSMC’s CoWoS technology holds a 95% market share.
Qualcomm and Meta announced a multi-generational strategic partnership agreement for data center CPUs.
TSMC accelerates the development of its local DRAM supply chain, with Winbond Electronics assisting in the supply of memory wafers.
Samsung: HCB technology is expected to become an important technological foundation for enhancing the mass production competitiveness of HBM4E in the future.
Samsung and SK Hynix will invest US$517.87 billion to build chip factories in southwestern South Korea.
Malaysian customs seized smuggled AI chips worth $13 million.
Musk announced that Grok 4.5 has begun internal private testing at SpaceX and Tesla, and its performance may surpass that of Opus.
Micron announced that it has secured $22 billion in memory chip orders from customers.
Arm: Currently, chips based on the Arm architecture account for more than 50% of the hyperscale cloud market.
South Korean officials said that DRAM production capacity and the global memory market are expected to double and quadruple respectively within five years.
