UK and US reached a technology cooperation agreement, and US companies such as Microsoft and Nvidia will invest $42 billion in the UK. Alibaba new AI chip leaked: Key parameters comparable to H20. IonQ CEO Niccolò de Masi: A 10,000-qubit…
Nvidia may face fines of up to $3.42 billion to $8.55 billion in China. China and US reached a basic framework consensus on properly resolving the TikTok issue. iPhone 18 to be launched in 2026 will be the first to…
Nvidia is reported to be the first customer for TSMC A16 process. Wccftech TSMC has captured 38% of the global foundry 2.0 market. Counterpoint Research MediaTek flagship SoC chip based on TSMC 2nm has taped out and will be mass-produced and…
Samsung Exynos 2600 beats the A19 Pro in multi-core performance. It is reported that Micron has suspended DRAM quotations and is expected to increase prices by 30%. Arm has successfully captured 25% of the data center CPU market. OpenAI Chairman…
NVIDIA Grace CPU drives Arm server share growth. Alibaba and Baidu use self-developed AI chips to train AI models, partially replacing Nvidia GPUs. Malaysia restricts data center expansion, and China’s acquisition of AI chips is hindered. China Semiconductor Industry Association:…
Nvidia has launched another AI chip B30A for mainland China, which is rumored to use TSMC 5nm process. Apple CEO Tim Cook talked about partnering with TSMC to invest $600 billion to increase American-made chips. Qualcomm and Google Cloud expand collaboration…
Nvidia has violated China Anti-Monopoly Law, and the State Administration for Market Regulation has decided to conduct further investigation. Microsoft plans to invest $700 million in UK data center infrastructure. Samsung first 2nm chip, the Exynos 2600, will go into…
SK Hynix was the first in the world to complete the development of HBM4 and establish a mass production system. Wei Shaojun: China should stop using Nvidia GPUs to develop AI. Kioxia plans to launch AI SSD developed in collaboration…
TSMC made a major adjustment: The old 8-inch wafer factory switched to producing EUV mask protective film. HBF (High Bandwidth Flash) will soon rise and develop in parallel with HBM. Thelec China AI chip production capacity is growing, but advanced…
The advanced packaging market size will exceed US$79.4 billion in 2030, with at least 7 factories developing simultaneously in mainland China. Yole Group SIA: Global semiconductor sales increased by 20.6% year-on-year in July 2025, with China increasing by 10.4%. ST…
