
Semiconductor Industrial Breaking News
SK Hynix: Yield in the HBM hybrid bonding process has improved. DNA molecular computers…

SK Hynix: Yield in the HBM hybrid bonding process has improved. DNA molecular computers…

TSMC: Expanding capacity at “double speed”, with 2nm production expected to grow by about…

DeepSeek V4 switched to Huawei chips, abandoning NVIDIA chips. Samsung purchases DRAM hafnium materials…

Intel CEO Lip-Bu Tan: Xeon server CPUs are expected to maintain strong growth momentum…

TSMC will begin mass production of 1.3nm semiconductors in 2029. OpenAI has released a…

TSMC unveils its latest roadmap: A12, A13 and N2U process technologies released; high numerical…

TSMC has been steadily increasing its 3nm capacity to meet the surge in demand…

Samsung has indefinitely postponed mass production of the HBM5E due to substandard yield rates.…

TSMC’s 2nm capacity is already saturated, while Samsung’s foundry services are targeting customers’ replacement…