Samsung has indefinitely postponed mass production of the HBM5E due to substandard yield rates.
SK Hynix’s advanced packaging plant began construction in April 2026.
Amazon has reduced the construction time for its AI data centers from 15 weeks to 3 weeks.
US court reopened VLSI’s patent infringement case against INTEL involving a staggering $3 billlion.
STMicroelectronics begins mass production of 40nm MCUs in China.
Forge Nano, a US semiconductor equipment manufacturer, will go public for $1.6 billion through a SPAC transaction.
Samsung shareholders will hold an “anti-strike rally” to oppose the distribution of $27.2 billion in bonuses.
TP-Link has applied for an exemption from the US router ban and emphasized that it is an independent US entity.
German DDR5 chip prices have rebounded to 410% of the level in July 2025.
