TSMC North American TECHNOLOGY SYMPOSIUM revealed: 1.4nm process will be mass-produced in 2028.
It is rumored that Intel 18A will receive orders from Nvidia, Broadcom and other manufacturers. wccftech
TSMC cutting-edge SoW-X packaging technology will be mass-produced in 2027, with computing power 40 times higher than CoWoS.
TI raises Q2 outlook but warns of risks from US-China tariff tensions.
Qualcomm joins hands with China’s “Automobile Circle of Friends” to appear at the 2025 Shanghai Auto Show: accelerating the popularization of driver assistance and promoting innovative upgrades in cockpit driving.
ROHM unveils compact SiC modules for high-density EV onboard chargers.
NielsenIQ predicts that PC shipments will grow 3% to 4% year-on-year, which will benefit the PC supply chain performance of Acer, Asus and contract manufacturers such as Quanta, Compal and Wistron.
Murata launches US-based CVC arm to target semiconductor and 6G innovation.
Intel officially announced layoffs and restructuring begin in Q2 2025.
