MediaTek CEO Tsai Ming-kai is optimistic about the cloud ASIC market and will cooperate with NVIDIA to expand into the AI field.
TI and NVIDIA collaborate on 800V power architecture for next-gen AI data centers.
Foxconn Chairman Young Liu: Driven by the dual engines of AI and electric vehicles, revenue will reach a new high in 2025.
Global companies lost $34 billion! Trump’s tariff storm continues to expand.
ASE has launched FOCoS-Bridge packaging technology with through-silicon vias, which can reduce power loss in AI/HPC applications by 72%.
Dell full-year profit outlook exceeds expectations as AI server orders surge.
TPCA: The global output value of high-density connection boards will increase by 8.7% year-on-year in 2025.
Infineon, LG and Hanwha advance cooperation in smart car electronics.
Synopsys and Cadence confirmed receipt of the BIS notice, which may be intended only for “military end users.”
