Nvidia has broken out and developed a downgraded chip for the Chinese mainland market, and it is expected that the B30 will meet US standards.
SoftBank and Intel are working together to develop a new type of AI memory that promises to cut power consumption in half.
TSMC US new factory has received a large number of orders from Apple, AMD, Qualcomm, Broadcom and Nvidia.
Samsung 3nm yield rate is only 50%. South Korean media
Western Digital plans to release a 36TB HAMR hard drive in 2027.
US has reportedly suspended the export of jet engine technology to China.
TDK launches industry’s smallest 0201-size high-frequency inductors for RF modules.
Innolux invests in FOPLP technology. Hong Jinyang: There will be concrete results in 2025.
Amazon plans to expand its data centers and increase deployment of Nvidia AI chips.
