Nvidia has reportedly ordered 300,000 H20 chips from TSMC due to strong Chinese demand.
It is reported that the price of AMD MI350 series has skyrocketed by 66.7%.
TSMC US first advanced packaging plant will break ground in 2026 and is expected to be completed in 2029.
Positron AI Atlas accelerator has stronger inference performance, but its power consumption is only 33% of Nvidia H200.
The US-Japan $550 billion trade agreement may provide financing for Taiwanese companies that are building semiconductor fabs in US.
New research from Musk brain-computer company Neuralink has been revealed: Using AI to develop bionic eyes.
TCL Huaxing supplies foldable OLED displays for Lenovo new mobile phones Moto Razer 60.
NXP launches new 18-channel battery controller ICs to boost EV and ESS performance.
European Commission: EU and US will form a metal alliance to deal with China overcapacity.
