Trump: Nvidia H20 performance is “outdated” and Huawei already has similar chips.
SK Hynix has upgraded 1c DRAM to more than 5 layers of EUV, laying the foundation for High NA EUV applications.
Sandisk and SK Hynix are collaborating on high-bandwidth flash memory: Bandwidth comparable to HBM, with 8 to 16 times higher capacity.
Intel Nova Lake mobile version details exposed: HX series can reach up to 28 core CPU, 4 core Xe3 iGPU.
ASE acquired Win Foundry’ factory for $216.60 million to expand its advanced packaging production capacity.
Ceva maintains its top spot in the wireless connectivity IP rankings, according to a new report from IPnest.
Samsung is developing a 415mm×510mm panel-level advanced package SoP.
