TSMC US packaging plant has begun land preparation and aims to open in 2028.
IBM announced a collaboration with AMD to develop a quantum-centric supercomputing architecture.
Taiwan: The impact of US chip tariffs on TSMC is limited, as only 1% of its semiconductor components are sold directly to US.
Samsung OLED display market share is 34.6%, ranking first in the world.
Qualcomm launches the world’s first enterprise-class mobile processor with fully integrated RFID capabilities.
Zunpai infringement of Huawei chip technology case: The first-instance judgment has come into effect.
Japanese photomask maker Tekscend Photomask plans an IPO with a valuation of $2 billion.
NVIDIA details the Spectrum-X Photonics network switch, an integrated optoelectronic package.
Details of IBM Power11 processor revealed: Samsung 7nm process, up to 16-core CPU on a single chip.
Nvidia has released its most powerful robotics chip yet, the Jetson Thor series.
