Apple will take over more than half of TSMC 2nm production capacity in 2026 and adopt WMCM advanced packaging.
Dell is backing Intel, with the PowerEdge XE7740 set to feature the Gaudi 3 AI chip.
Huawei Ascend AI chip roadmap announced: Ascend 970 will be launched in 2028 with a computing power of 4 PFLOPS.
Apple is trial-producing a foldable iPhone in Taiwan and aims to mass-produce it in India by 2026.
LG Display plans to replace the metal foil material of OLED panels to reduce costs.
Renesas launches RA0L1 MCUs with ultra-low power and capacitive touch features.
Equipped with Snapdragon 8 Elite Gen 5, Xiaomi 17 Pro’s running score was exposed.
Global cellular IoT module shipments rise 17% in Q2 2025, led by China and India.
Trump: Chip tariffs will be higher than 25%.
