TSMC continues to improve EUV lithography efficiency, increasing wafer output 30 times in 6 years.
ASM fully deploys ALD and new materials to address the challenges of GAA and CFET.
Samsung is reported to have signed a Power11 chip foundry order with IBM.
Apple A19 Pro’s multi-core energy efficiency is 34% higher than that of Dimensity 9400.
Nordic Semiconductor strengthens edge AI strategy.
Edge Foundry expands infrared sensor business to strengthen South Korea’s semiconductor sector.
Vishay introduces first automotive-grade surface-mount Y1 safety capacitors.
Hisense releases the world’s largest 150-inch laser TV, ushering in the IMAX era of home viewing.
Although Nvidia has not yet announced the foundry service contract, industry analysts believe that Nvidia acquired Intel shares to win the support of the Trump administration.
