OpenAI, Oracle, and SoftBank announced the expansion of the Stargate infrastructure project, which will include the construction of 5 AI centers across US.
AI is triggering a “storage super cycle” and Samsung price increases may continue until 2026. Morgan Stanley
Tesla is actively recruiting semiconductor talents and working with Samsung to build a 2nm AI6 chip.
Micron confirmed the success of HBM4 and plans to mass-produce in H1 2026.
Solidigm releases the world’s first liquid-cooled SSD: Double-sided efficient heat dissipation, maximum capacity of 7.68TB.
Microsoft introduces microfluidics technology to cool AI chips from the inside.
SoftBank Group has reduced the number of its subsidiaries by a quarter as it bets everything on AI infrastructure.
LA Semiconductor plans to sell its Idaho wafer fab.
Taiwan restricts chip exports to South Africa.
