imec announced two breakthroughs in high-NA EUV lithography technology.
Companies like Amazon and Google informed Jensen Huang of the progress of their self-developed AI chips to avoid supply disruptions.
TSMC OIP partner list has been announced: 13 EDA vendors, 31 semiconductor IP suppliers, and 28 TSMC 3DFabric® Alliance members.
US Department of Commerce has introduced in-depth regulations to expand export controls on China.
All EU member states have joined the European Semicon Coalition and plan to launch version 2.0 of the European Chip Act.
GlobalFoundries and Corning are collaborating to deliver detachable fiber optic connector solutions to expand next-generation fiber optic connectivity.
Vishay launches new 1200 V hyperfast rectifiers for industrial and automotive use.
ROHM and Infineon expand cooperation on SiC power device packaging.
