TSMC advanced packaging production capacity will reach full capacity in 2026, and ASE and King Yuan Electronics will also usher in strong growth.
The launch of Apple iPhone 17 has driven a surge in TSMC orders.
BYD R&D expenses in H1 2025 ranked among the top five global passenger car manufacturers, with a year-on-year increase of more than 50%.
Japanese electronic component manufacturers are adjusting their global production and reducing their production capacity in China.
Applied Materials has unveiled an atomic-scale chip device designed to boost the performance of next-generation AI chips.
China Mobile: The country largest intelligent computing infrastructure will be built by the end of 2028.
The liquid cooling market is expected to grow by 96% in 2024, and single-phase cold plate liquid cooling will become the mainstream solution. Omdia
Global PC shipments grew 9.4% to 75.8 million units in Q3 2025, with Lenovo expanding its lead.
