C.C. Wei: TSMC will continue to increase the production capacity of CoWoS advanced packaging in 2026.
Nvidia is partnering with Australia Firmus Technologies to invest $2.9 billion in data centers.
OpenAI: Oracle assists in handling AI chip export control issues.
The world’s first sub-angstrom snapshot spectral imaging chip “Yuheng” was launched.
US Federal Communications Commission plans to ban Hong Kong telecom providers from operating in US.
UK announced that it would add 11 Chinese entities to its sanctions list, including several electronic component distributors.
Tekscend, Japanese semiconductor photomask maker, went public, rising 13% on its first day.
As the supply chain “decouples”, companies such as Microsoft, AWS, and Google are accelerating the relocation of production out of China.
Synopsys and TSMC are collaborating to enable 2D and 3D design solutions.
