The widening capacity gap at CoWoS is primarily due to strong demand from Nvidia and AMD.
SK Hynix deepens cooperation with TSMC to jointly develop new base dies on HBM.
Deutsche Telekom and Nvidia have partnered to create a $1.17 billion industrial AI cloud platform.
MediaTek and the European Space Agency have completed the world’s first R19 5G-Advanced satellite broadband network connection.
Nexperia warns: No one can guarantee when Chinese factories will resume shipping.
US Treasury Secretary Scott Bessant: Nvidia most powerful chips could be sold to China within the next year or two.
IBM announced it will lay off thousands of employees in Q4 2025.
The global MEMS packaging substrate market is projected to reach $3.2 billion by 2030, with glass substrates being the fastest-growing segment. MarketsandMarkets
German auto parts suppliers are urgently applying to China for an export exemption for Nexperia chips.
