Intel CEO Lip-Bu Tan is personally overseeing the AI business; the former CTO Sachin Katti has left to join OpenAI.
Micron wafer fab project in Clay, New York, will be significantly delayed until 2033 before it can begin production.
Texas Instruments’ second packaging and testing facility in Malaysia has begun operations, packaging billions of chips annually.
Infineon opens dedicated UWB Application Lab in Austria to advance automotive and industrial positioning.
SIA says Q3 2025 global chip sales rose 15.8% as Asia and Americas drive recovery.
AI chip startup Rebellions completes $238.99 million funding round.
With the increase in HBM stacking layers, Macronix is rumored to raise NOR flash memory prices by 30% in Q4 2025.
US Bureau of Industry and Security (BIS) announced a one-year suspension of the 50% penetration rule in export controls and removed Arrow Electronics (China) from the Entity List.
GlobalFoundries has licensed GaN technology from TSMC, targeting the data center, industrial, and automotive markets.
