Intel: TSMC wafer supply is insufficient, and the production capacity of CPUs such as Arrow Lake is limited.
Samsung has improved its 4nm process yield to 60-70% and secured a chip order worth over $100 million from a US AI company.
AWS and NVIDIA have partnered to launch their first self-developed 3nm chip.
The shortage of DDR4/DDR5 memory will continue until Q4 2027.
TSMC advanced packaging division is experiencing a surge in orders, prompting it to accelerate capacity expansion and outsourcing to strengthen its equipment supply chain, including companies such as Hung Miao and Wan Run.
Samsung is expected to regain the top spot in the global DRAM market in Q4 2025.
Storage device prices rise: Lenovo, Dell, and HP plan to raise prices.
CoWoP (Chip on Wafer on PCB) new order is expected to be acquired by ASE.
NVIDIA GTC developer conference will be held on March 16th 2026. Jensen Huang will announce the latest progress of Vera Rubin then.
