TSMC is facing a shortage of advanced packaging capacity; NVIDIA captured more than half of TSMC capacity in 2026.
SK Hynix collaborates with NVIDIA to accelerate the development of its next-generation AI NAND flash memory, aiming to achieve storage performance 30 times faster than existing enterprise-class solid-state drives by 2027. ZDNet
Kioxia wafer fab in Iwate Prefecture will produce 332-layer NAND chips in 2026 to meet the needs of AI data centers.
European Commission has approved $729.16 million in state aid to Germany to support the construction of two chip factories in Germany.
STMicroelectronics has reached a $1.2 billion credit line agreement with the European Investment Bank (EIB).
Snapdragon Ride Flex Acceleration Cockpit integrates driving and acceleration functions and has been applied to several new models.
Murata ventures into quantum cryptography to extend semiconductor and components market.
Market share of mobile eMMC/UFS is expected to grow by 25% to 30% by Q1 2026. CFM
China Ministry of Commerce urged Nexperia Dutch to send representative to China ASAP.
