STMicroelectronics has delivered more than 5 billion radio frequency antenna chips to SpaceX.
It’s reported that Samsung will withdraw from the SATA SSD market, which could drive up the overall price of SSDs.
SK Hynix ordered a hot press bonding machine from ASMPT for the production of HBM4.
NXP plans to exit the 5G power amplifier business and will close its US GaN factory.
NTT Chairman: Japan needs to adopt a niche market strategy to revitalize its chip industry.
TE to raise connector prices from early 2026, impacting chip supply chain.
ASML CEO: The improved high numerical aperture EUV lithography solution has been validated and is expected to be mass-produced in 2027-2028.
It’s reported that Samsung plans to expand its supply of HBM3E chips, potentially becoming Broadcom’s largest supplier.
STMicroelectronics: May deliver 10 billion chips to SpaceX by 2027.
