TSMC second wafer fab in US will begin receiving equipment in the summer of 2026, with 3nm process expected to mass-produce in 2027.
Reports indicate that Waymo is in talks to raise $10 billion, which would value the company at over $100 billion.
Amazon restructures AI division: Integrating chip, quantum computing, and general AI businesses.
Moore Threads LiteGS: Winner of a Grand Prize in the 3DGS Graphics Challenge.
Volkswagen has halted production at one of its German plants for the first time due to cost pressures.
Apple has begun developing a 24-inch iMac OLED panel.
Mythic, AI chip startup, has raised $125 million to develop low-power analog chips.
Samsung is expanding its Micro RGB TV lineup, showcasing new products at CES 2026.
Micron CEO: DRAM shortage will continue beyond 2026; customers are signing multi-year contracts to lock in capacity.
