Battle for memory erupts: Google fired its purchasing chief, and Microsoft negotiation chief left the table in anger.
South Korea Semiconductor Industry Association predicts that by 2040, 0.2nm chips using CFET and monolithic 3D design will be mass-produced.
NVIDIA CEO Jensen Huang and AMD CEO Lisa Su will deliver keynote speeches on the eve of CES 2026 to discuss the future development of AI.
US has concluded the previous administration investigation into China semiconductor trade and will not impose additional tariffs on Chinese chips within the next 18 months.
China Ministry of Commerce: We firmly oppose the US imposing Section 301 tariffs on Chinese semiconductor products and have lodged a solemn representation with the US side.
BYD vehicle collision avoidance patent has been published, which can improve the success rate of collision avoidance.
Haier Smart Home announces sale of 49% stake in its Indian business. Bloomberg
It’s reported that ASUS will produce DRAM chips in 2026 to address the memory shortage.
Cadence has successfully taped out a 64Gbps UCIe IP solution based on TSMC N3P technology.
