TSMC weighs further Arizona expansion with fabs and advanced packaging.
TSMC manufacturing costs in US are 2.4 times higher than in Taiwan.
Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts.
Arm reshapes business, creates physical AI unit to expand robotics and automotive push.
Moore Threads: Officially releases SimuMax version 1.1, an open-source distributed training and simulation tool for large-scale models.
Japanese wafer dicing equipment manufacturer DISCO’s shipments in Q4 2025 fell 18% year-on-year to $571.43 million.
SIA: Global semiconductor sales reached a record $75.3 billion in November 2025.
TEL is heavily investing in the AI chip boom: Market is about to usher in a long-term “super cycle”.
ASE may raise packaging prices by 5%–20%, above prior expectations.
