TSMC continues to increase investment in advanced packaging because Apple A20 chip may use WMCM technology.
Samsung expects its overall capacity utilization rate for its wafer foundry business to recover to 60% in H1 2026.
SK Hynix DRAM process at its Wuxi, China plant has been successfully upgraded, with a monthly production capacity of 180,000 wafers.
Japanese Finance Minister Satsuki Katayama stated that Japan plans to invest over $330 billion in AI and semiconductors.
OpenAI aims to achieve over $20 billion in revenue and 1.9 gigawatts of computing power by 2025.
Thailand has approved a $2.07 billion PCB project investment led by Zhen Ding Technology.
Samsung Galaxy A57 is the first phone to use a CSOT (China Star Optoelectronics Technology) OLED screen, designed to address rising costs.
SK On is expanding its energy storage system (ESS) product line to meet the needs of different application scenarios.
AXT, a supplier of indium phosphide (InP) substrates, predicts its CPO business may experience a boom in 2028-2029.
