TSMC plans to build a 3nm chip factory in Japan, with an investment of US$17 billion.
AMD predicts its AI business will boom in H2 2026; CEO Lisa Su emphasized that the new chip will accelerate production.
Rapidus has secured more than $1.02 billion in private investment, with IBM potentially becoming a shareholder.
NanoXplore and STMicroelectronics jointly launched an aerospace-grade FPGA chip for the European market.
Siemens acquires Canopus AI, a French semiconductor measurement software company.
TE Connectivity announces price increase effective March 2026 due to rising metal costs.
MOLEX announces price adjustment starting February 2026.
The third phase of Yangtze Memory project is scheduled to be completed and put into operation in 2026.
Current rise in international DRAM prices is mainly concentrated on DDR3 chips. TrendForce
