NVIDIA to invest $30 billion in OpenAI.
OpenAI and Cerebras have released their first third-party chip AI model.
ByteDance builds AI team in the US.
It’s reported that Apple self-designed baseband chip C1X has experienced its first hardware failure and may be unrepairable, requiring device replacement.
The demand for sensors is driving the next wave of growth, and MEMS packaging is becoming a new battleground for technological competition.
EU plans to require electric vehicles to contain 70% domestically produced components in order to be eligible for subsidies.
Malaysia has invested US$46.12 million to establish an advanced packaging alliance to drive the semiconductor industry toward higher value-added transformation.
Lenovo is facing a class-action lawsuit in the US, accused of illegally transferring large amounts of data.
AI is “siphoning away” memory production capacity, exacerbating the risk of a NAND flash memory shortage in 2026.
