Jensen Huang: NVIDIA has partnered with TSMC to fully mass-produce co-packaged optical chips for use in the Spectrum X chip.
NVIDIA releases the Vera Rubin platform, which features 256 LPUs per rack.
SK Hynix showcased its AI-driven memory competitiveness at NVIDIA GTC 2026.
Memory chip prices are rising: Samsung’s Galaxy division has cancelled high-end products such as the Galaxy Z TriFold.
US semiconductor blockade against China actually accelerated China’s process of achieving self-sufficiency in semiconductor technology. South Korean media
Penang invests $10.20 million to build the ATE Industrial Park, aiming to upgrade the semiconductor supply chain.
The MEMS packaging substrate market is projected to reach $3.23 billion by 2030, with glass substrates becoming a new growth engine. MarketsandMarkets
Several mobile phone manufacturers announced price adjustments.
SK Group Chairman: Memory chip shortage may continue until 2030.
Jensen Huang: NVIDIA’s advanced AI chip market will reach $1 trillion by 2027.
