TSMC approves $20.6575 billion capital budget for building advanced process and other production capacity.
Samsung is focusing on SOP advanced packaging, which may be used in Tesla’s AI6 chip.
Apple’s M5 chip has been postponed to 2026 and will use advanced LMC packaging technology.
Huawei releases Unified Communications Manager (UCM) technology: Reducing dependence on HBM and promoting an enhanced AI inference experience.
Arm neural technology release: GPU introduction in 2026 can reduce workload by 50%.
South Korean semiconductor exports increased 31.2% year-on-year in July 2025.
Musk confirmed that the Robotaxi platform will be open to the public and will be widely available in 2026.
US plans to expand the “sale in exchange for export licenses” model to other companies.
It is reported that Alibaba and ByteDance were asked to explain the legality of purchasing Nvidia H20 chips.
