TSMC’s CoWoS yield exceeded 98%, and photomask size will increase 14 times by 2029.
Samsung plans to commercialize high numerical aperture EUV lithography technology at the 1nm process node.
SK Hynix is reportedly restarting construction of its second NAND flash memory manufacturing plant in Dalian, China.
IBM and Together AI sign a $240 million cloud services agreement.
Samsung Electro-Mechanics’ glass substrate business has been hampered by its failure to pass customer certification, and investment in production lines has been delayed.
South Korea plans to develop a 100-qubit quantum computer by 2029 independently and strives to become a leader in quantum chip manufacturing by 2035.
Samsung SDI acquired a stake in a joint venture with General Motors to jointly develop prismatic batteries and gain a foothold in the North American energy storage system market.
Google has officially released the Pixel 11 series of new phones powered by the Google Tensor G6 chip.
Foxconn will begin shipping NVIDIA Vera Rubin platforms in Q4 2026.
