Samsung and SK Hynix will reduce their NAND flash memory wafer production in 2026. ChosunBiz
Global DRAM supply forecast for 2027 may be revised upward. TrendForce
Japan and US are moving forward with a $550 billion investment plan; SoftBank’s data center project has reportedly been included in the first phase of the plan. Reuters
Eric Demers, a renowned GPU architect, joins INTEL.
US Federal Trade Commission has launched an investigation into “talent acquisition” practices by tech giants aimed at circumventing antitrust scrutiny.
Resonac announced to increase the price of PCB materials (such as CCL adhesive sheets) from March 1st, 2026.
Gree Electric Appliances will begin mass production of silicon carbide chips for automotive applications. Dong Mingzhu stated that half of the chips will be supplied to GAC Group in the future.
Construction of INTEL Ohio One wafer fab project is progressing rapidly.
Samsung will begin testing EUV lithography machines at its Taylor One plant in US, starting in March 2026.
