Samsung has released its UFS 5.0 product.
Storage technology upgrade: Advanced packaging becomes the key to success.
According to supply chain sources, the monthly production capacity of TSMC’s main 28nm production base, Fab 15A, has decreased by more than 25% compared to the beginning of 2026.
It’s reported that Samsung P5 Fab 2 project in Pyeongtaek is planned to break ground in July 2026.
LG Display’s OLED panels have received Intertek color and brightness accuracy certification.
Groq raises $650 million to transform into an AI inference data center operator.
MediaTek’s price increases are influencing integrated circuit design trends, and power management equipment manufacturers may follow suit.
South Korean President Lee Jae-myung will discuss regional investment with Samsung.
Qualcomm is reportedly planning to acquire AI chip startup Modular for $4 billion.
Nippon Sanso plans to raise global helium prices by more than 30% starting in July 2026.
