NVIDIA suppliers halt production of key components for H200 chips.
It’s reported that Samsung improved the yield of 2nm process to 50% and plans to achieve profitability in its foundry business by 2027.
It’s reported that Xiaomi Xring O2 mobile processor will use TSMC N3P process.
DDR4 prices could rise by as much as 50% in Q1 2026, while NOR Flash prices will rise by 30%. Morgan Stanley
Samsung plans to close an 8-inch wafer fab in H2 2026 and focuses to the high-value-added 12-inch wafer fab.
South Korea is in talks with US over chip tariffs to avoid unfavorable trade terms.
Replacing the interposer with a silicon bridge: INTEL EMIB package emphasizes cost and design freedom advantages.
OpenAI announced a multi-billion dollar collaboration agreement to deploy 750 megawatts of AI chips.
SK Hynix and Samsung are accelerating the commercialization of HBF. The “father of HBM” stated that HBF could be used in products of NVIDIA, AMD and Google as early as 2027.
