NVIDIA and Broadcom have begun shipping CPO switches in small batches; optical engine yield and advanced packaging capabilities are key factors.
It’s reported that NVIDIA is in talks with OpenAI to provide approximately $250 billion in financial guarantees for a large data center project in Ohio.
Samsung and SK Group have signed a $950 billion semiconductor deal with US companies.
Samsung signed a MOU with Broadcom to collaborate on up to $200 billion in memory chips, 2nm wafer foundry, and advanced packaging by 2030.
It’s reported that SK Group will supply $750 billion worth of chips to US technology companies, including NVIDIA.
Anthropic signed supply agreements with Samsung and SK Hynix.
NVIDIA has officially released its first US-made GB300 AI chip, manufactured using TSMC’s 4nm process at Fab 21 facility in Arizona.
It’s reported that TSMC’s monthly production capacity for its 2nm process at a single fab is 20,000 wafers.
Qualcomm and Tesla are both using TSMC’s 3nm process, which is operating at full capacity with orders extending to 2027.
