TSMC 2nm expansion project in the Southern Taiwan Science Park is scheduled to be completed in 2028.
Samsung is reportedly adjusting its production of HBM and general-purpose DRAM due to soaring prices.
ASML: We expect extreme ultraviolet lithography machines to increase wafer throughput by 50% per hour by 2030.
Foxconn and HCL broke ground on a joint venture packaging and testing plant in India, with a total investment of approximately US$4.1 billion.
Broadcom has launched the BroadPeak, a DFE (Digital Front End) SoC chip compatible with both 5G-A and 6G standards.
Global spending on display devices is projected to grow by 32% year-on-year by 2026. Counterpoint Research
Taalas, AI chip startup, raises $169 million.
Musk criticizes Anthropico: Massive misuse of training data.
Taiwan has added 18 new export control measures for high-tech products, including advanced chip equipment and quantum computers.
