The surge in demand for copper-clad laminates for PCBs has led to delivery times extending to six weeks.
JSR plans to build a factory in Taiwan and collaborate with TSMC to develop advanced photoresists.
Rivian is considering developing its own lidar sensors or collaborating with Chinese companies.
VIS Chairman Fang Lue has, for the first time, hinted that VIS will take a cautious approach to building a second 12-inch wafer fab.
INTEL has appointed former Qualcomm executive Alex Katouzian to lead its PC and physical AI business.
Samsung Chairman: Strike will have serious consequences.
Geely will acquire Ford’s “Body 3” third body assembly line at Almuzafez plant in Valencia, Spain.
Nissan cut 10% of European workforce and merged production lines at UK plant as part of a global restructuring.
It’s reported that Anthropic has pledged $200 billion to Google’s cloud services and chips.
