Samsung: By 2026, 2nm production capacity will more than double compared to 2025.
Micron offers more LPDDR5X capacity options to support next-generation edge designs.
Qualcomm’s CEO: HBC Gen 1 has completed tape-out and custom chips have entered the wafer production stage.
Samsung plans to increase the proportion of sales under long-term contracts to 60-70%.
TSMC: Construction work on its JASM wafer fab in Kumamoto, Japan, resumed today.
SpaceX maintains strict control over its supply chain and excludes Chinese employees and equipment.
SEMI: Global silicon wafer shipments increased by 7.4% year-on-year in Q2 2026.
EU plans to invest $11.4 billion to build seven AI-powered super factories, with public funds expected to attract an additional $22.8 billion in private investment.
